作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
S7CV
w,2 3DNow!(3D no waiting)
+bUW!$G 3DPA(3D Positional Audio,3D定位音频)
'#W_boN 3DS(3D SubSystem,三维子系统)
W^k,Pmopy ABS(Auto Balance System,自动平衡系统)
iV!@bC, AC(Audio Codec,音频多媒体数字信号编解码器)
5}XvL' ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
1q]&7R ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
=*O=E@] AE(Atmospheric Effects,雾化效果)
> ws!5q AFR(Alternate Frame Rendering,交替渲染技术)
?Wa<AFXQ AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
[Tp%"f1 AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
m6i%DE AGU(Address Generation Units,地址产成单元)
J(e7{aRJ9 AH: Authentication Header,鉴定文件头
iDw.i"b AHA(Accelerated Hub Architecture,加速中心架构)
&\^rQi/tf AL: Artificial Life(人工生命)
U-g9C. ALU(Arithmetic Logic Unit,算术逻辑单元)
Xu6K%]i^ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
036[96t,F AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
t8/%Dgu Anisotropic Filtering(各向异性过滤)
yj
zK.dM API(Application Programming Interfaces,应用程序接口)
~RInN+N# APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
@VK6JjIq APM(Advanced Power Management,高级能源管理)
VoM6 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
"r. . ARP(Address Resolution Protocol,地址解析协议)
! Mo`^t ASC(Anti Static Coatings,防静电涂层)
LG&5VxT=,< ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
|` "? ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
G6Nb{m ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
6,+nRiZ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
9B=1Yr[ ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
QPs:R hV7 ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
[7.agI@= AST(Average Seek time,平均寻道时间)
YE\K<T
jH ATA(AT Attachment,AT扩展型)
'$[Di'*; ATAPI(AT Attachment Packet Interface)
`Mk4sKU\a ATC(Access Time from Clock,时钟存取时间)
qfrNi1\9- ATL: ActiveX Template Library(ActiveX模板库)
^A!$i$NON ATM(Asynchronous Transfer Mode,异步传输模式)
`WnQ ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
smup,RNZRX ATX: AT Extend(扩展型AT)
6D/tK| Auxiliary Input(辅助输入接口)
x8\<qh*: AV(Analog Video,模拟视频)
h e&V# # AVI(Audio Video Interleave,音频视频插入)
8+&JQ"UaB Back Buffer,后置缓冲
mU@xcN Backface culling(隐面消除)
>DP:GcTG BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
3=-
})X; Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
!re1EL BCF(Boot Catalog File,启动目录文件)
`!i-#~n Benchmarks:基准测试程序数值
[/$N!2'5 BGA(Ball Grid Array,球状矩阵排列)
RJ}#)cT BGA(Ball Grid Array,球状矩阵排列)
wkBL=a BGA: Ball Grid Array(球状网格阵列)
3?`" BHT(branch prediction table,分支预测表)
?WHy0x20 BIF(Boot Image File,启动映像文件)
#epy%> Bilinear Filtering(双线性过滤)
p`P~i&_ BIOS(Basic Input/Output System,基本输入/输出系统)
mCdgKr|n BLA: Bearn Landing Area(电子束落区)
e&1\'Zq?> BMC(Black Matrix Screen,超黑矩阵屏幕)
i_ QcC BOD(Bandwidth On Demand,弹性带宽运用)
BJ5}GX! BOPS:Billion Operations Per Second,十亿次运算/秒
BQ#L+9% bps(bit per second,位/秒)
m@\ZHbq BPU(Branch Processing Unit,分支处理单元)
re`t ]gzb Brach Pediction(分支预测)
0^&!6R BSD(Berkeley Software Distribution,伯克利软件分配代号)
2|{V,!/cvG BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
l r~gG3 BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
hs(W;tR@W C2C: card-to-card interleaving,卡到卡交错存取
; LMWNy4 CAD: computer-aided design,计算机辅助设计
c1%rV`)] CAM(Common Access Model,公共存取模型)
_| zBUrN CAS(Column Address Strobe,列地址控制器)
62\&RRB
i CBR(Committed Burst Rate,约定突发速率)
XYfv(y CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
KDTDJ8 CCD(Charge Coupled Device,电荷连接设备)
q3S+Y9L CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
ST;t,
D: CCM(Call Control Manager,拨号控制管理)
&&7r+.Y cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Oy_c CCS(Cut Change System)
j@| `f((4 CCT(Clock Cycle Time,时钟周期)
Eju~}:Lo CDR(CD Recordable,可记录光盘)
WG5W0T_ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
M_|> kp CDRW(CD-Rewritable,可重复刻录光盘)
!w2gGy:I> CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
f /y` CE(Consumer Electronics,消费电子)
DWm SC}{. CEM(cube environment mapping,立方环境映射)
n:4uA`Vg Center Processing Unit Utilization,中央处理器占用率
Z
cpmquf8L CEO(Chief Executive Officer,首席执行官)
|W7rr1]~S CG(Computer Graphics,计算机生成图像)
_0(7GE13p CGI(Common Gateway Interface,通用网关接口)
b{5K2k&, CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
Tlodn7%", CIEA: Commercial Internet Exchange Association,商业因特网交易协会
]KuMz p! CIR(Committed Infomation Rate,约定信息速率)
]'h; {;ug CISC(Complex Instruction Set Computing,复杂指令集计算机)
XG 0v CISC(Complex Instruction Set Computing,复杂指令集计算机)
VQxpN 1 CISC: Complex Instruction Set Computing(复杂指令结构)
vAi$[p*im Clipping(剪贴纹理)
o6L9UdT CLK(Clock Cycle,时钟周期)
>/^#Drwb!i Clock Synthesizer,时钟合成器
2UadV_s+s CLV(Constant Linear Velocity,恒定线速度)
_MfD CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
.CbGDZ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
1-VT}J( CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
fly,-$K>LO COB(Cache on board,板上集成缓存)
2R.2D'4)` COB(Cache on board,板上集成缓存)
UVEz;<5@\ COD(Cache on Die,芯片内集成缓存)
J4aBPq` COD(Cache on Die,芯片内集成缓存)
q_t4OrLr= COM: Component Object Model(组件对象模式)
?c#$dc" COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
,pt%)
c compressed textures(压缩纹理)
8;" *6vHZ Concurrent Command Engine,协作命令引擎
(^n*Am;zlH COO(Chief Organizer Officer,首席管理官)
51xk>_Hm}| CP: Ceramic Package(陶瓷封装)
#T3h}= CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
:&w{\-0{ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
jbte
*Ae CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
n$["z
w CPS: Certification Practice Statement(使用证明书)
%y<]Yzv. CPU(Center Processing Unit,中央处理器)
jirbUl CPU: Centerl Processing Unit(中央处理器)
glUo7^ay7 CPU:Center Processing Unit,中央处理器
nH[+n `{o CRC: Cyclical Redundancy Check(循环冗余检查)
f3tv3>p CRT(Cathode Ray Tube,阴极射线管)
*fc-gAj CS(Channel Separation,声道分离)
c&'JmKV>& CSE(Configuration Space Enable,可分配空间)
%fjuG CSS(Common Command Set,通用指令集)
z#Nl@NO& CSS: Cascading Style Sheets,层叠格式表
Fn|gVR CTO(Chief Technology Officer,首席技术官)
]v 29 Rx CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
uTvv(f CTS(Clear to Send,清除发送)
'Kbl3fUF CVS(Compute Visual Syndrome,计算机视觉综合症)