作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
|bY@HpMp 3DNow!(3D no waiting)
}s~c(sL?; 3DPA(3D Positional Audio,3D定位音频)
'UX.Q7W 3DS(3D SubSystem,三维子系统)
OIcXelS:@k ABS(Auto Balance System,自动平衡系统)
`z|0O AC(Audio Codec,音频多媒体数字信号编解码器)
#a8kA"X ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
']M/'CcM ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
bKQho31a'
AE(Atmospheric Effects,雾化效果)
M-o'`e' AFR(Alternate Frame Rendering,交替渲染技术)
'R7 \ AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
V@
>(xe7 AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
U+Y(: AGU(Address Generation Units,地址产成单元)
JVc{vSa!rm AH: Authentication Header,鉴定文件头
8SGaS& AHA(Accelerated Hub Architecture,加速中心架构)
9wvlR6z;u AL: Artificial Life(人工生命)
QQ(}71U ALU(Arithmetic Logic Unit,算术逻辑单元)
6mM9p)"$ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
* ,hhX
psa AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
NAR6q{c Anisotropic Filtering(各向异性过滤)
/LD3Bb)O API(Application Programming Interfaces,应用程序接口)
t3;Zx+Br APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
R;< q<i_l APM(Advanced Power Management,高级能源管理)
2Rk}ovtD[ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
s2<!Zb4 ARP(Address Resolution Protocol,地址解析协议)
Zy}tZ RG ASC(Anti Static Coatings,防静电涂层)
l=~!'1@L} ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
YF5}~M ymF ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
MEDh ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
/F0q8j0 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
PYkhY;* ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
M+/G>U ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
bZnOX*y] AST(Average Seek time,平均寻道时间)
5hrI#fpOR ATA(AT Attachment,AT扩展型)
SVCh!/qe\ ATAPI(AT Attachment Packet Interface)
MGg(d ATC(Access Time from Clock,时钟存取时间)
}3(!kW ATL: ActiveX Template Library(ActiveX模板库)
)Qbd/zd\U ATM(Asynchronous Transfer Mode,异步传输模式)
owAO&"C ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
}p)K6!J0 ATX: AT Extend(扩展型AT)
y*
+y& Auxiliary Input(辅助输入接口)
Y}?8 AV(Analog Video,模拟视频)
W2vL< AVI(Audio Video Interleave,音频视频插入)
DR#" 3 Back Buffer,后置缓冲
5UEZpxnv Backface culling(隐面消除)
~7]V^tG BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
*8}b&4O~ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
{r^_ g(.q BCF(Boot Catalog File,启动目录文件)
^m>4<~/ Benchmarks:基准测试程序数值
^6s im 2 BGA(Ball Grid Array,球状矩阵排列)
c!6D{(sfh BGA(Ball Grid Array,球状矩阵排列)
U+S=MP
}: BGA: Ball Grid Array(球状网格阵列)
n]4E>/\ BHT(branch prediction table,分支预测表)
Uj!3MF BIF(Boot Image File,启动映像文件)
IKD{3cVL Bilinear Filtering(双线性过滤)
cn'>dz3v BIOS(Basic Input/Output System,基本输入/输出系统)
|L2>|4 BLA: Bearn Landing Area(电子束落区)
SQodk:1) BMC(Black Matrix Screen,超黑矩阵屏幕)
DHO]RRGV BOD(Bandwidth On Demand,弹性带宽运用)
Blpk
n1 BOPS:Billion Operations Per Second,十亿次运算/秒
,B <\a bps(bit per second,位/秒)
(5yM%H8: BPU(Branch Processing Unit,分支处理单元)
1NZ"\9=U Brach Pediction(分支预测)
F y+NJSG BSD(Berkeley Software Distribution,伯克利软件分配代号)
z0 "DbZ;d BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
:j\7</uu BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
c./\sN@ C2C: card-to-card interleaving,卡到卡交错存取
)x.%PUA CAD: computer-aided design,计算机辅助设计
iU)I"#\l'k CAM(Common Access Model,公共存取模型)
t~Q9}+ CAS(Column Address Strobe,列地址控制器)
r.C6`
a CBR(Committed Burst Rate,约定突发速率)
oRV}Nz7hr CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
Rh="<'d CCD(Charge Coupled Device,电荷连接设备)
e5L+NPeM6v CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
NRRJlY
S CCM(Call Control Manager,拨号控制管理)
_7c3=f83 cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
'.A!IGsj CCS(Cut Change System)
8`4M4"lj CCT(Clock Cycle Time,时钟周期)
DX_mrG CDR(CD Recordable,可记录光盘)
e(c\ U}& CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
[|]J8o@u^ CDRW(CD-Rewritable,可重复刻录光盘)
:'%6 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
'Y?-."eKh CE(Consumer Electronics,消费电子)
X=)V<2WO CEM(cube environment mapping,立方环境映射)
bLc5$U$!I Center Processing Unit Utilization,中央处理器占用率
CoN[Yf3\ CEO(Chief Executive Officer,首席执行官)
-]N2V'QB CG(Computer Graphics,计算机生成图像)
h<.5:a CGI(Common Gateway Interface,通用网关接口)
(J:+'u CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
Eb3 ZM# CIEA: Commercial Internet Exchange Association,商业因特网交易协会
o_:v?Y>0 CIR(Committed Infomation Rate,约定信息速率)
EGu%;[ CISC(Complex Instruction Set Computing,复杂指令集计算机)
BA;r%?MRL CISC(Complex Instruction Set Computing,复杂指令集计算机)
(.J/Ql0Y CISC: Complex Instruction Set Computing(复杂指令结构)
MO`Y&<g~A Clipping(剪贴纹理)
^C>kmo3J CLK(Clock Cycle,时钟周期)
!:(+# Clock Synthesizer,时钟合成器
qGinlE&\ CLV(Constant Linear Velocity,恒定线速度)
[,=?e CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
}M07-qIX{ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
d4Uw+3ikW CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
b?~p/[ COB(Cache on board,板上集成缓存)
rj4@ COB(Cache on board,板上集成缓存)
<8r"QJY/ COD(Cache on Die,芯片内集成缓存)
!=9x= COD(Cache on Die,芯片内集成缓存)
so-5%S COM: Component Object Model(组件对象模式)
+=tdgw/ COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
Wf~^,]9N compressed textures(压缩纹理)
w-|Rb~XT
h Concurrent Command Engine,协作命令引擎
nrEI0E9 COO(Chief Organizer Officer,首席管理官)
_>gz& CP: Ceramic Package(陶瓷封装)
]ch=@IV CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
)nN!% |J CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
GS;GJsAs CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
1/dL-"*0 CPS: Certification Practice Statement(使用证明书)
G ek?+|m CPU(Center Processing Unit,中央处理器)
L%/RD2LD CPU: Centerl Processing Unit(中央处理器)
L8 P0bNi CPU:Center Processing Unit,中央处理器
y_X6{}Ke CRC: Cyclical Redundancy Check(循环冗余检查)
fNNl1Vls CRT(Cathode Ray Tube,阴极射线管)
SmXoNiM"y CS(Channel Separation,声道分离)
F`D$bE;| CSE(Configuration Space Enable,可分配空间)
h:Pfiw] CSS(Common Command Set,通用指令集)
T3w%y`K CSS: Cascading Style Sheets,层叠格式表
*C*J1JYp+ CTO(Chief Technology Officer,首席技术官)
DB}Uzw| CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
y0%@^^-Ru CTS(Clear to Send,清除发送)
} z'Jsy[s CVS(Compute Visual Syndrome,计算机视觉综合症)