作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
|sa7Y_ 3DNow!(3D no waiting)
]F;]<_ 3DPA(3D Positional Audio,3D定位音频)
U_'q- *W 3DS(3D SubSystem,三维子系统)
AFTed?( ABS(Auto Balance System,自动平衡系统)
Pfx71*u, AC(Audio Codec,音频多媒体数字信号编解码器)
_kN%6~+U ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
)c/y07er ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
)`mF.87b&h AE(Atmospheric Effects,雾化效果)
dY<#a,eS AFR(Alternate Frame Rendering,交替渲染技术)
; ZV^e AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
5R `6zhf AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
`YNC_r#tG AGU(Address Generation Units,地址产成单元)
%E"/]!}3 AH: Authentication Header,鉴定文件头
"NH+qQhs AHA(Accelerated Hub Architecture,加速中心架构)
7RE6y(V1 AL: Artificial Life(人工生命)
B:4qW[U# ALU(Arithmetic Logic Unit,算术逻辑单元)
~^~RltY AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
tq[",&K AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
~@ b}=+n Anisotropic Filtering(各向异性过滤)
\C#b@xLnX API(Application Programming Interfaces,应用程序接口)
5,BkwAr+6[ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
y=xe<#L APM(Advanced Power Management,高级能源管理)
g/Jj]X#r APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
cGta4; ARP(Address Resolution Protocol,地址解析协议)
IQ=|Kj9h ASC(Anti Static Coatings,防静电涂层)
,7jiHF ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
*.%)rm ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
x[W]?`W3r~ ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
-#;VFSz,9* ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
FR^wDm$ ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
jjT2k ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
MZW
Y AST(Average Seek time,平均寻道时间)
0C+yq'D~[ ATA(AT Attachment,AT扩展型)
3dDQz# ATAPI(AT Attachment Packet Interface)
[e@OHQM ATC(Access Time from Clock,时钟存取时间)
,
)pt_"-XA ATL: ActiveX Template Library(ActiveX模板库)
W?J*9XQ` ATM(Asynchronous Transfer Mode,异步传输模式)
ioa_AG6B ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
<VR&=YJ ATX: AT Extend(扩展型AT)
'3UIriY6 Auxiliary Input(辅助输入接口)
dzNaow*0&V AV(Analog Video,模拟视频)
PB<Sc>{U AVI(Audio Video Interleave,音频视频插入)
N|d.!Q;V.y Back Buffer,后置缓冲
soQzIx Backface culling(隐面消除)
n;^k BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
7W firRM Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
:$Q]U2$mPS BCF(Boot Catalog File,启动目录文件)
OGi4m | Benchmarks:基准测试程序数值
| ,l=v`/ BGA(Ball Grid Array,球状矩阵排列)
bA^:p3 BGA(Ball Grid Array,球状矩阵排列)
[-Tt11 BGA: Ball Grid Array(球状网格阵列)
%802H%+ BHT(branch prediction table,分支预测表)
H&=4y) /. BIF(Boot Image File,启动映像文件)
h9w^7MbO Bilinear Filtering(双线性过滤)
wQrPS BIOS(Basic Input/Output System,基本输入/输出系统)
o p5^9`" BLA: Bearn Landing Area(电子束落区)
DD6`k*RIk. BMC(Black Matrix Screen,超黑矩阵屏幕)
us,,W(q BOD(Bandwidth On Demand,弹性带宽运用)
<T.#A8c BOPS:Billion Operations Per Second,十亿次运算/秒
C\2 >7 bps(bit per second,位/秒)
UFAMbI BPU(Branch Processing Unit,分支处理单元)
?CW^*So Brach Pediction(分支预测)
_E<O+leWf BSD(Berkeley Software Distribution,伯克利软件分配代号)
X1V}%@3: BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
MN M> BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
b,
**$ C2C: card-to-card interleaving,卡到卡交错存取
CE7pg&dJ)i CAD: computer-aided design,计算机辅助设计
e9hVX[uq CAM(Common Access Model,公共存取模型)
6dR-HhF CAS(Column Address Strobe,列地址控制器)
m>-^K CBR(Committed Burst Rate,约定突发速率)
u3i|}` CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
"ko?att~ CCD(Charge Coupled Device,电荷连接设备)
M3;v3
}z<- CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
?]:EmP CCM(Call Control Manager,拨号控制管理)
g yH7((#i cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
sEJ;t0.LX CCS(Cut Change System)
-anFt+f- CCT(Clock Cycle Time,时钟周期)
dYew7 CDR(CD Recordable,可记录光盘)
?r'TH/> CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
nh&J3b}B! CDRW(CD-Rewritable,可重复刻录光盘)
-k[tFBlw CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
e5>5/l]jsg CE(Consumer Electronics,消费电子)
v6DxxE2n CEM(cube environment mapping,立方环境映射)
U>B5LU9& Center Processing Unit Utilization,中央处理器占用率
k5%0wHpk = CEO(Chief Executive Officer,首席执行官)
MV;Y?%> CG(Computer Graphics,计算机生成图像)
UFIAgNKl CGI(Common Gateway Interface,通用网关接口)
D7_Hu'y<o CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
Jn@Mbl CIEA: Commercial Internet Exchange Association,商业因特网交易协会
cwWSNm| CIR(Committed Infomation Rate,约定信息速率)
5)n:<U* CISC(Complex Instruction Set Computing,复杂指令集计算机)
W
"\tkh2 CISC(Complex Instruction Set Computing,复杂指令集计算机)
CWe>jlUQ CISC: Complex Instruction Set Computing(复杂指令结构)
Zc\h15+P Clipping(剪贴纹理)
0O['-x CLK(Clock Cycle,时钟周期)
vD)A) Clock Synthesizer,时钟合成器
T.w}6?2 CLV(Constant Linear Velocity,恒定线速度)
$L&9x3+?Kg CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
$7gB&T.x CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
vLK\X$4 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
;]oXEq` COB(Cache on board,板上集成缓存)
q%kj[ZOY$] COB(Cache on board,板上集成缓存)
7MuK/q. COD(Cache on Die,芯片内集成缓存)
o!l3.5m2d COD(Cache on Die,芯片内集成缓存)
Xm^h5jAr COM: Component Object Model(组件对象模式)
Eagmafu COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
B-ri}PA compressed textures(压缩纹理)
G_, t\ Concurrent Command Engine,协作命令引擎
?m9UhLeaS= COO(Chief Organizer Officer,首席管理官)
Va/@#=,q] CP: Ceramic Package(陶瓷封装)
K,C$J
I CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
^2;(2s CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
pW3)Y5/D CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
@a.6?.<L CPS: Certification Practice Statement(使用证明书)
3e!Yu.q: CPU(Center Processing Unit,中央处理器)
;LF)u2x= CPU: Centerl Processing Unit(中央处理器)
F<ocY0=9p CPU:Center Processing Unit,中央处理器
fCt\2);a CRC: Cyclical Redundancy Check(循环冗余检查)
.iP G /e CRT(Cathode Ray Tube,阴极射线管)
%X9:R'~ sP CS(Channel Separation,声道分离)
MNf @HG CSE(Configuration Space Enable,可分配空间)
&W)+8N,L CSS(Common Command Set,通用指令集)
[;IDTo!<> CSS: Cascading Style Sheets,层叠格式表
++Ys9Y)*, CTO(Chief Technology Officer,首席技术官)
TH(Lzrbg CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
Ky'3z" CTS(Clear to Send,清除发送)
x,w`OMQ}c CVS(Compute Visual Syndrome,计算机视觉综合症)