作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
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3DNow!(3D no waiting)
V3r1|{Z( 3DPA(3D Positional Audio,3D定位音频)
lI~T>Lel2 3DS(3D SubSystem,三维子系统)
ZfsM($|a ABS(Auto Balance System,自动平衡系统)
7}>Zq`]~ AC(Audio Codec,音频多媒体数字信号编解码器)
j}t"M|` ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
33IJbg ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
T#KF@8'- AE(Atmospheric Effects,雾化效果)
`S$zwot AFR(Alternate Frame Rendering,交替渲染技术)
W6%\Zwav?) AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
#;~`+[y?\ AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
?-C=_eZJ AGU(Address Generation Units,地址产成单元)
g?&_5)& AH: Authentication Header,鉴定文件头
=;Ap+} AHA(Accelerated Hub Architecture,加速中心架构)
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)H AL: Artificial Life(人工生命)
5-qk"@E W ALU(Arithmetic Logic Unit,算术逻辑单元)
:59fb"^$ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
Hj(ay48 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
Lu?MRF
f Anisotropic Filtering(各向异性过滤)
G%5bQ|O API(Application Programming Interfaces,应用程序接口)
Ck.LsL- APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
rHYSS0*3 APM(Advanced Power Management,高级能源管理)
%:Mi6sR| APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
mWEaUi)Zz ARP(Address Resolution Protocol,地址解析协议)
+5~5BZP ASC(Anti Static Coatings,防静电涂层)
J,q6 ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
9bu}@#4* ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
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?uHAm ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
jEU`ko_ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
q9+`pj ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
X%JQ_Z ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
3<F\5| AST(Average Seek time,平均寻道时间)
.Z?@;2<l ATA(AT Attachment,AT扩展型)
st4z+$L ATAPI(AT Attachment Packet Interface)
3mef;!q ATC(Access Time from Clock,时钟存取时间)
8[v9|r ATL: ActiveX Template Library(ActiveX模板库)
ZW+M<G ATM(Asynchronous Transfer Mode,异步传输模式)
{o>51fXc) ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
b^s978qn# ATX: AT Extend(扩展型AT)
H#/ #yVw Auxiliary Input(辅助输入接口)
@G'&7-(h* AV(Analog Video,模拟视频)
zP554Gr ? AVI(Audio Video Interleave,音频视频插入)
oW
! Z=; Back Buffer,后置缓冲
n$Nb,/o Backface culling(隐面消除)
9d kuvk}: BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
n0)0"S|y1 Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
S:5vC{ BCF(Boot Catalog File,启动目录文件)
vtx3a^ Benchmarks:基准测试程序数值
)T0%<(J BGA(Ball Grid Array,球状矩阵排列)
\iL{q^Im BGA(Ball Grid Array,球状矩阵排列)
}`fFzb BGA: Ball Grid Array(球状网格阵列)
96ydcJY0' BHT(branch prediction table,分支预测表)
@~p;.=1]F BIF(Boot Image File,启动映像文件)
Z01BzIsR Bilinear Filtering(双线性过滤)
S2+X/YeB BIOS(Basic Input/Output System,基本输入/输出系统)
a%nksuP3 BLA: Bearn Landing Area(电子束落区)
n1XJuc~ BMC(Black Matrix Screen,超黑矩阵屏幕)
mH`K~8pRg BOD(Bandwidth On Demand,弹性带宽运用)
1PGY/c
BOPS:Billion Operations Per Second,十亿次运算/秒
5z/*/F=X bps(bit per second,位/秒)
9!XXuMWU< BPU(Branch Processing Unit,分支处理单元)
4e`GMtp Brach Pediction(分支预测)
:<}1as!eo BSD(Berkeley Software Distribution,伯克利软件分配代号)
"kb[}r4? BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
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BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
WR|n> i@m C2C: card-to-card interleaving,卡到卡交错存取
bv:M
zYS CAD: computer-aided design,计算机辅助设计
s8:-*VR9 CAM(Common Access Model,公共存取模型)
P55QE+B CAS(Column Address Strobe,列地址控制器)
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W6{` CBR(Committed Burst Rate,约定突发速率)
+jD*Jtb< CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
W _b!FQ] CCD(Charge Coupled Device,电荷连接设备)
)70i/%}7 CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
reP)&Fo CCM(Call Control Manager,拨号控制管理)
pZxuV(QP` cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
bT>1S2s CCS(Cut Change System)
!&(^R<-id CCT(Clock Cycle Time,时钟周期)
!#[B#DZc( CDR(CD Recordable,可记录光盘)
Z:(Zy CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
]nIH0k3y CDRW(CD-Rewritable,可重复刻录光盘)
;9Sb/ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
6 Mc&gnN CE(Consumer Electronics,消费电子)
Ot<vn34mt: CEM(cube environment mapping,立方环境映射)
y/vGt_^;3< Center Processing Unit Utilization,中央处理器占用率
KT3n-Y-, CEO(Chief Executive Officer,首席执行官)
QH5[}zs8 CG(Computer Graphics,计算机生成图像)
b}APD))*H! CGI(Common Gateway Interface,通用网关接口)
HpKF7oJ'N CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
7jS`4, CIEA: Commercial Internet Exchange Association,商业因特网交易协会
y1qJ CIR(Committed Infomation Rate,约定信息速率)
faIHmU CISC(Complex Instruction Set Computing,复杂指令集计算机)
_8 C:Md` CISC(Complex Instruction Set Computing,复杂指令集计算机)
{,X}Btnwp CISC: Complex Instruction Set Computing(复杂指令结构)
<sncW>?!~ Clipping(剪贴纹理)
?y/LMja CLK(Clock Cycle,时钟周期)
L#|6Lnp^ Clock Synthesizer,时钟合成器
,@Fde=Lw CLV(Constant Linear Velocity,恒定线速度)
vk><S|[n CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
0rrNVaM CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
R3bHX%T CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
H13kNhV9 COB(Cache on board,板上集成缓存)
w}rsboU COB(Cache on board,板上集成缓存)
E+"m@63 COD(Cache on Die,芯片内集成缓存)
QKHAN{hJ COD(Cache on Die,芯片内集成缓存)
1F,>siuh , COM: Component Object Model(组件对象模式)
FW@(MIH COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
Gnthz0\]{ compressed textures(压缩纹理)
EEJ OJ< Concurrent Command Engine,协作命令引擎
"3;b,<0 COO(Chief Organizer Officer,首席管理官)
y _:~ CP: Ceramic Package(陶瓷封装)
$S'~UbmYU CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
~PZIYG"D CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
AZH=r S` CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
$! R]!s CPS: Certification Practice Statement(使用证明书)
!Y,*Zc$R CPU(Center Processing Unit,中央处理器)
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