作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
Y8AU<M 3DNow!(3D no waiting)
) Z^(+ 3DPA(3D Positional Audio,3D定位音频)
Q \{\uJ x 3DS(3D SubSystem,三维子系统)
=T\pq8 ABS(Auto Balance System,自动平衡系统)
fx}R7GN2 AC(Audio Codec,音频多媒体数字信号编解码器)
bqe;) A7 ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
lLg23k{' ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
yV]-![`D AE(Atmospheric Effects,雾化效果)
d>aZpJ[. AFR(Alternate Frame Rendering,交替渲染技术)
v\HGL56T AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
a1}W2;W0]g AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
:7`,dyIqT AGU(Address Generation Units,地址产成单元)
G!Uq#l> AH: Authentication Header,鉴定文件头
)q=1<V44d AHA(Accelerated Hub Architecture,加速中心架构)
J*;t{M5 AL: Artificial Life(人工生命)
v |i(peA# ALU(Arithmetic Logic Unit,算术逻辑单元)
-I|yi' AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
cKxJeM07 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
\u)(+t{ Anisotropic Filtering(各向异性过滤)
}5]NUxQ_ API(Application Programming Interfaces,应用程序接口)
nnE@1X3 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
$]T7Iwk APM(Advanced Power Management,高级能源管理)
X;0EgIqh3 APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
\e=@h!p ARP(Address Resolution Protocol,地址解析协议)
%v|,-B7Yx ASC(Anti Static Coatings,防静电涂层)
$:xUXEi{ ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
J]~3{Mi ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
eR}d"F4W ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
k9bU< ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
0P)c)x5 ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
pkT
a^I ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
=]^*-f}J9 AST(Average Seek time,平均寻道时间)
/!E /9[V ATA(AT Attachment,AT扩展型)
T0SD|' ATAPI(AT Attachment Packet Interface)
: i(h[0 ATC(Access Time from Clock,时钟存取时间)
BHU[Rz7x ATL: ActiveX Template Library(ActiveX模板库)
`"bm Hs7 ATM(Asynchronous Transfer Mode,异步传输模式)
tz)L`g/J~ ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
xCQ<G{;C ATX: AT Extend(扩展型AT)
L,l+1`Jz Auxiliary Input(辅助输入接口)
~+d]yeDrhx AV(Analog Video,模拟视频)
"w A8J%: AVI(Audio Video Interleave,音频视频插入)
Jne)?Gt Back Buffer,后置缓冲
`^6}Dn Backface culling(隐面消除)
ZNx{7]=a BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
9!R !H& Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
7i'vAOnw^ BCF(Boot Catalog File,启动目录文件)
^*0;Z<_ Benchmarks:基准测试程序数值
`P GWu1/ BGA(Ball Grid Array,球状矩阵排列)
c8yD-U/- BGA(Ball Grid Array,球状矩阵排列)
%bv<OMD BGA: Ball Grid Array(球状网格阵列)
[2
Rp.? BHT(branch prediction table,分支预测表)
|M0TG BIF(Boot Image File,启动映像文件)
@!F9}n
AP Bilinear Filtering(双线性过滤)
8CYJR/ BIOS(Basic Input/Output System,基本输入/输出系统)
;ndg,05_ BLA: Bearn Landing Area(电子束落区)
k"n#4o: BMC(Black Matrix Screen,超黑矩阵屏幕)
{1qEN_ERx BOD(Bandwidth On Demand,弹性带宽运用)
&556 ;l BOPS:Billion Operations Per Second,十亿次运算/秒
bLUn0)c bps(bit per second,位/秒)
AUN Tc3 BPU(Branch Processing Unit,分支处理单元)
) ejvT- Brach Pediction(分支预测)
J6Kfz~% BSD(Berkeley Software Distribution,伯克利软件分配代号)
^ZV xBQKg BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
;J`X0Vl$ BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
&hF>}O C2C: card-to-card interleaving,卡到卡交错存取
CBvBBt* CAD: computer-aided design,计算机辅助设计
-Pvt+I> CAM(Common Access Model,公共存取模型)
N[mOJa: CAS(Column Address Strobe,列地址控制器)
PzF)Vg CBR(Committed Burst Rate,约定突发速率)
a`{'u)@ CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
Dp'/uCW) CCD(Charge Coupled Device,电荷连接设备)
?Jma^ S CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
X)|%[aX}q CCM(Call Control Manager,拨号控制管理)
|W::\yu6 cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
?e ~* ,6 CCS(Cut Change System)
. XY'l CCT(Clock Cycle Time,时钟周期)
LZ@^ A]U CDR(CD Recordable,可记录光盘)
}^ iE|YKz CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
B
51LZP CDRW(CD-Rewritable,可重复刻录光盘)
&v`kyc CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
v(0vP}[Q7E CE(Consumer Electronics,消费电子)
pLIBNo? CEM(cube environment mapping,立方环境映射)
eygyVhJ Center Processing Unit Utilization,中央处理器占用率
ES+&e/G"ds CEO(Chief Executive Officer,首席执行官)
>0m-S :lk CG(Computer Graphics,计算机生成图像)
.)o5o7H CGI(Common Gateway Interface,通用网关接口)
'IgtBd|K> CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
a@X'oV`(2b CIEA: Commercial Internet Exchange Association,商业因特网交易协会
Kzmgy14o CIR(Committed Infomation Rate,约定信息速率)
X31k HK5F_ CISC(Complex Instruction Set Computing,复杂指令集计算机)
"y`?KY$[N CISC(Complex Instruction Set Computing,复杂指令集计算机)
x0#+yP CISC: Complex Instruction Set Computing(复杂指令结构)
o]FQ)WRB Clipping(剪贴纹理)
'z\F-Ttq CLK(Clock Cycle,时钟周期)
fHgfI@{=j Clock Synthesizer,时钟合成器
v|e\o~2D` CLV(Constant Linear Velocity,恒定线速度)
_l Jj 6= CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
hVID~L$ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
5-g0 2g CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
`ybZE+S. COB(Cache on board,板上集成缓存)
iUO5hdOM COB(Cache on board,板上集成缓存)
l%)XPb2$J COD(Cache on Die,芯片内集成缓存)
cbIW>IbM COD(Cache on Die,芯片内集成缓存)
E>[~"~x"pV COM: Component Object Model(组件对象模式)
~C[,P\, COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
_,'UP>Si compressed textures(压缩纹理)
l==T3u
r Concurrent Command Engine,协作命令引擎
IEA[]eik> COO(Chief Organizer Officer,首席管理官)
h0gT/x CP: Ceramic Package(陶瓷封装)
Z86[sQBg CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
n1LS*-@ CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
%GIla* CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
N
Lo>"<Xb CPS: Certification Practice Statement(使用证明书)
Z,2uN!6 CPU(Center Processing Unit,中央处理器)
(thzWr6; CPU: Centerl Processing Unit(中央处理器)
`?>OY&( CPU:Center Processing Unit,中央处理器
hIw*dob CRC: Cyclical Redundancy Check(循环冗余检查)
B U)4g[4 CRT(Cathode Ray Tube,阴极射线管)
JAn3 CS(Channel Separation,声道分离)
6?`py}: CSE(Configuration Space Enable,可分配空间)
$51#xe CSS(Common Command Set,通用指令集)
^=@%@mR/[C CSS: Cascading Style Sheets,层叠格式表
U9If%0P CTO(Chief Technology Officer,首席技术官)
@GEvI2Vf.0 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
yWs/~5[F CTS(Clear to Send,清除发送)
}`eeIt I+ CVS(Compute Visual Syndrome,计算机视觉综合症)