作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
aaD;jxT&M| 3DNow!(3D no waiting)
9]q:[zm^ 3DPA(3D Positional Audio,3D定位音频)
&gzCteS 3DS(3D SubSystem,三维子系统)
e[hcJz!D ABS(Auto Balance System,自动平衡系统)
`{qG1 AC(Audio Codec,音频多媒体数字信号编解码器)
[JF150zr ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
g=I8@m ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
E@7J:|.)R AE(Atmospheric Effects,雾化效果)
,#pXpAz/ AFR(Alternate Frame Rendering,交替渲染技术)
0RoU}r@z4 AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
J9~g|5 AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
{e|[%reSkg AGU(Address Generation Units,地址产成单元)
Z+@2"%W AH: Authentication Header,鉴定文件头
E Cyyl AHA(Accelerated Hub Architecture,加速中心架构)
U8
nH;}i AL: Artificial Life(人工生命)
+TXX$)3% ALU(Arithmetic Logic Unit,算术逻辑单元)
"etPT@gF AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
j~*L~7 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
W.kM7z>G Anisotropic Filtering(各向异性过滤)
6{txm+U API(Application Programming Interfaces,应用程序接口)
itC-4^ APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
Ja9e^`i; APM(Advanced Power Management,高级能源管理)
D9M:^ APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
s6>ZREf#J ARP(Address Resolution Protocol,地址解析协议)
=:~R=/ZXk ASC(Anti Static Coatings,防静电涂层)
KEWTBBg ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
>,td(= : ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
jy'13G/b\ ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
z[Xd%mhjO ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
P#AW\d^"B ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
TqnTS0fx ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
>y,-v:Vy AST(Average Seek time,平均寻道时间)
%n*-VAfE\ ATA(AT Attachment,AT扩展型)
D-c`FG' ATAPI(AT Attachment Packet Interface)
K.0:C`C ATC(Access Time from Clock,时钟存取时间)
Hw4%uS==V ATL: ActiveX Template Library(ActiveX模板库)
1YH+d0UGn ATM(Asynchronous Transfer Mode,异步传输模式)
MG.`
r{5 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
Hro-d1J7 ATX: AT Extend(扩展型AT)
Dd\jHF>u Auxiliary Input(辅助输入接口)
P'_H/r/# AV(Analog Video,模拟视频)
<)3u6Vky9 AVI(Audio Video Interleave,音频视频插入)
0=?<y'= Back Buffer,后置缓冲
soQ1X@"0 Backface culling(隐面消除)
Oeok; : BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
.X;3,D[w Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
/{&tY:;m BCF(Boot Catalog File,启动目录文件)
bD?VU<)3 Benchmarks:基准测试程序数值
R~PA1wDZ BGA(Ball Grid Array,球状矩阵排列)
#)nSr BGA(Ball Grid Array,球状矩阵排列)
aeD ;5VV BGA: Ball Grid Array(球状网格阵列)
sfNE68I2 BHT(branch prediction table,分支预测表)
!4X
f~P BIF(Boot Image File,启动映像文件)
I"ok&^t^} Bilinear Filtering(双线性过滤)
}|pwz BIOS(Basic Input/Output System,基本输入/输出系统)
R#I0|;q4|p BLA: Bearn Landing Area(电子束落区)
1]p ZrBh"E BMC(Black Matrix Screen,超黑矩阵屏幕)
:>C2gS@ BOD(Bandwidth On Demand,弹性带宽运用)
0.@&_XTPl BOPS:Billion Operations Per Second,十亿次运算/秒
"/wyZ bps(bit per second,位/秒)
h-[VH% BPU(Branch Processing Unit,分支处理单元)
$69oV: Brach Pediction(分支预测)
=o$sxb
E( BSD(Berkeley Software Distribution,伯克利软件分配代号)
y]f"@9G# BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
2I,^YWR BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
9J2NH|]c C2C: card-to-card interleaving,卡到卡交错存取
W>j !Q^? CAD: computer-aided design,计算机辅助设计
M
r5v< CAM(Common Access Model,公共存取模型)
c_4[e5z CAS(Column Address Strobe,列地址控制器)
s*-n^o- CBR(Committed Burst Rate,约定突发速率)
l`f/4vy CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
N$U$5;r~` CCD(Charge Coupled Device,电荷连接设备)
md"!33 @ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
c"B{/;A CCM(Call Control Manager,拨号控制管理)
G6$kv2(k`@ cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
;5659!; CCS(Cut Change System)
.N
,3od@ CCT(Clock Cycle Time,时钟周期)
AT2n VakL CDR(CD Recordable,可记录光盘)
75XJL;W # CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
kH
G"XTL CDRW(CD-Rewritable,可重复刻录光盘)
Q$zO83 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
&B6Ep6QS CE(Consumer Electronics,消费电子)
f,018]| CEM(cube environment mapping,立方环境映射)
X\bOz[\ Center Processing Unit Utilization,中央处理器占用率
;)D];u|_ CEO(Chief Executive Officer,首席执行官)
xHD=\,{ig CG(Computer Graphics,计算机生成图像)
2#c<\s|C CGI(Common Gateway Interface,通用网关接口)
^")Q YE CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
H9YW CIEA: Commercial Internet Exchange Association,商业因特网交易协会
/`wvxKX CIR(Committed Infomation Rate,约定信息速率)
PHZ0P7 CISC(Complex Instruction Set Computing,复杂指令集计算机)
@~^5l CISC(Complex Instruction Set Computing,复杂指令集计算机)
j+$rj CISC: Complex Instruction Set Computing(复杂指令结构)
,-8"R`UI8 Clipping(剪贴纹理)
>0ow7Uw; CLK(Clock Cycle,时钟周期)
8%A#`)fb
Clock Synthesizer,时钟合成器
'>-gi}z7 CLV(Constant Linear Velocity,恒定线速度)
m
qMHL2~ CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
A%KDiIA CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
CDQW !XHc CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
=8AO: COB(Cache on board,板上集成缓存)
K,+LG7ec COB(Cache on board,板上集成缓存)
~A'!2 COD(Cache on Die,芯片内集成缓存)
pNepC<rY COD(Cache on Die,芯片内集成缓存)
xhVO3LW' COM: Component Object Model(组件对象模式)
jB%lB1Q| COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
n<O}hM ZT compressed textures(压缩纹理)
2bw_IT Concurrent Command Engine,协作命令引擎
!dyXJQ COO(Chief Organizer Officer,首席管理官)
<>y;.@}Q CP: Ceramic Package(陶瓷封装)
itBwCIj G CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
-GhP9; d CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
[q?<Qe CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
5:Z0Pt CPS: Certification Practice Statement(使用证明书)
;z}i-cNae CPU(Center Processing Unit,中央处理器)
B+\3-q CPU: Centerl Processing Unit(中央处理器)
lr>oYS0 CPU:Center Processing Unit,中央处理器
YIoQL}pX CRC: Cyclical Redundancy Check(循环冗余检查)
e7Xeo +/ CRT(Cathode Ray Tube,阴极射线管)
6#7Lm) g8 CS(Channel Separation,声道分离)
oHd FMD@ CSE(Configuration Space Enable,可分配空间)
&"f"; CSS(Common Command Set,通用指令集)
n}F&1Z CSS: Cascading Style Sheets,层叠格式表
3!XjtVhK?I CTO(Chief Technology Officer,首席技术官)
de.&`lPRf CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
Dz>^IMsY CTS(Clear to Send,清除发送)
)h"<\%LU CVS(Compute Visual Syndrome,计算机视觉综合症)