作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
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)`/`* 3DNow!(3D no waiting)
ddiBjp2.! 3DPA(3D Positional Audio,3D定位音频)
07:N)y, 3DS(3D SubSystem,三维子系统)
aur4Ky> : ABS(Auto Balance System,自动平衡系统)
V=LJ_T"z0 AC(Audio Codec,音频多媒体数字信号编解码器)
6xsB#v* ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
J&bhR9sF ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
}|W n6X AE(Atmospheric Effects,雾化效果)
I||4.YT AFR(Alternate Frame Rendering,交替渲染技术)
d#*n@@V4 AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
4Ev#`i3~ AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
hR1n@/nh AGU(Address Generation Units,地址产成单元)
[O52Bn AH: Authentication Header,鉴定文件头
DD]e0 pa AHA(Accelerated Hub Architecture,加速中心架构)
0p;pTc AL: Artificial Life(人工生命)
-B l!s^-' ALU(Arithmetic Logic Unit,算术逻辑单元)
*U69rbYI AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
vQiKpO* AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
4v("qNw# Anisotropic Filtering(各向异性过滤)
"\l O1D API(Application Programming Interfaces,应用程序接口)
RN0=jo!58 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
Z<,$XvL APM(Advanced Power Management,高级能源管理)
<#r/4a"V APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
[V-OYjPAx ARP(Address Resolution Protocol,地址解析协议)
ao(lj ASC(Anti Static Coatings,防静电涂层)
|{G GATni ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
}F~4+4B^ ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
ZXR#t?D ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
^`&?"yj<z ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
8A 3pYW- ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
Z1t?+v+Ro* ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
dY'mY ~Tv AST(Average Seek time,平均寻道时间)
vS$_H<;P ATA(AT Attachment,AT扩展型)
Mx<?c ATAPI(AT Attachment Packet Interface)
Pb(XR+ ATC(Access Time from Clock,时钟存取时间)
.h;PMY+ ATL: ActiveX Template Library(ActiveX模板库)
*+wGXm ATM(Asynchronous Transfer Mode,异步传输模式)
_CDl9pP36# ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
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qj: ATX: AT Extend(扩展型AT)
S)h0@;q Auxiliary Input(辅助输入接口)
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82<F AV(Analog Video,模拟视频)
jbU=D:| AVI(Audio Video Interleave,音频视频插入)
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.5 Back Buffer,后置缓冲
(pFPuV Backface culling(隐面消除)
."#M
X! BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
,py:e>+^t Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
X/D^?BKC BCF(Boot Catalog File,启动目录文件)
]U8VU Benchmarks:基准测试程序数值
And|T 6u BGA(Ball Grid Array,球状矩阵排列)
}>|M6.n " BGA(Ball Grid Array,球状矩阵排列)
fZ*LxL BGA: Ball Grid Array(球状网格阵列)
.<Lbv5m BHT(branch prediction table,分支预测表)
=Bq3O58+ BIF(Boot Image File,启动映像文件)
RrPo89o Bilinear Filtering(双线性过滤)
+TQMA>@g< BIOS(Basic Input/Output System,基本输入/输出系统)
B?G!~lQ)o BLA: Bearn Landing Area(电子束落区)
nbGB84 BMC(Black Matrix Screen,超黑矩阵屏幕)
#`>46T BOD(Bandwidth On Demand,弹性带宽运用)
{B_pjs BOPS:Billion Operations Per Second,十亿次运算/秒
fuQb h bps(bit per second,位/秒)
_ `RCY^t BPU(Branch Processing Unit,分支处理单元)
4R~f Brach Pediction(分支预测)
HZHzjrx BSD(Berkeley Software Distribution,伯克利软件分配代号)
n4YedjHSN BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
y[W<vb+F BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
wLDWD,"K C2C: card-to-card interleaving,卡到卡交错存取
Z?#_3h$"T CAD: computer-aided design,计算机辅助设计
1gTW*vLM\ CAM(Common Access Model,公共存取模型)
-or^mNB_z CAS(Column Address Strobe,列地址控制器)
aNLkkkJg<; CBR(Committed Burst Rate,约定突发速率)
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P[ CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
opKk#40 CCD(Charge Coupled Device,电荷连接设备)
(np %urx! CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
/_`f b)f CCM(Call Control Manager,拨号控制管理)
&3nbmkM cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
@4'bI) CCS(Cut Change System)
:RH0.5) CCT(Clock Cycle Time,时钟周期)
DeAi'"& CDR(CD Recordable,可记录光盘)
.[1"3!T CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
u9:+^F+ CDRW(CD-Rewritable,可重复刻录光盘)
>brf7h CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
=deqj^&@ CE(Consumer Electronics,消费电子)
9<9 c^2 CEM(cube environment mapping,立方环境映射)
>Y h7By Center Processing Unit Utilization,中央处理器占用率
Y~</vz+H CEO(Chief Executive Officer,首席执行官)
y$]gmg CG(Computer Graphics,计算机生成图像)
0x-58i0 CGI(Common Gateway Interface,通用网关接口)
huu v`$~y CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
*7ggw[~ CIEA: Commercial Internet Exchange Association,商业因特网交易协会
Oh\+cvbG CIR(Committed Infomation Rate,约定信息速率)
]7d~,<3R CISC(Complex Instruction Set Computing,复杂指令集计算机)
Kc>C$}/}$ CISC(Complex Instruction Set Computing,复杂指令集计算机)
Jf/X3\0N7 CISC: Complex Instruction Set Computing(复杂指令结构)
mv,<#<-W Clipping(剪贴纹理)
I.M@we/bR} CLK(Clock Cycle,时钟周期)
b* QRd Clock Synthesizer,时钟合成器
/%#LA CLV(Constant Linear Velocity,恒定线速度)
[&Z3+/lR* CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
QEavbh^S CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
@-~
)M_ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
Qe&K COB(Cache on board,板上集成缓存)
RcASFBNpS COB(Cache on board,板上集成缓存)
!F|mCEU COD(Cache on Die,芯片内集成缓存)
7^fpbrj COD(Cache on Die,芯片内集成缓存)
C{i9~80n COM: Component Object Model(组件对象模式)
j#C1+Us COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
p;GT[Ds^ compressed textures(压缩纹理)
d"1DE Concurrent Command Engine,协作命令引擎
'%u7XuU-] COO(Chief Organizer Officer,首席管理官)
[Ipg",Su;f CP: Ceramic Package(陶瓷封装)
r@2{>j8 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
jWg7RuN CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
~4YLPMGKl CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
{EoRY/] CPS: Certification Practice Statement(使用证明书)
C^o9::ER CPU(Center Processing Unit,中央处理器)
wc3OOyP@0 CPU: Centerl Processing Unit(中央处理器)
HOn,c@.9Y CPU:Center Processing Unit,中央处理器
^k'?e"[gTs CRC: Cyclical Redundancy Check(循环冗余检查)
b)SU8z!NV& CRT(Cathode Ray Tube,阴极射线管)
8fn7! CS(Channel Separation,声道分离)
1|?8g2Vf CSE(Configuration Space Enable,可分配空间)
h "7:&=e CSS(Common Command Set,通用指令集)
6O`s&T,t CSS: Cascading Style Sheets,层叠格式表
D['z/r6F CTO(Chief Technology Officer,首席技术官)
W-QBC-
3 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
aAlES< r CTS(Clear to Send,清除发送)
)wmG&"qsP CVS(Compute Visual Syndrome,计算机视觉综合症)