作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
/L!
=## 3DNow!(3D no waiting)
vKdS1Dn1 3DPA(3D Positional Audio,3D定位音频)
lY,9bSF$ 3DS(3D SubSystem,三维子系统)
"?
V;C ABS(Auto Balance System,自动平衡系统)
w+!V,lU"^ AC(Audio Codec,音频多媒体数字信号编解码器)
fffWvf ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
Jzy:^PObT ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
*?Wr^T AE(Atmospheric Effects,雾化效果)
]eFNR1<OP AFR(Alternate Frame Rendering,交替渲染技术)
km
lb,P AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
a #p`l>rx AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
=bvLMpa AGU(Address Generation Units,地址产成单元)
qf[J-"o AH: Authentication Header,鉴定文件头
7+[L6q/K AHA(Accelerated Hub Architecture,加速中心架构)
YLSDJ$K6 AL: Artificial Life(人工生命)
"8(8]GgYx ALU(Arithmetic Logic Unit,算术逻辑单元)
XIM?$p^ AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
|Df`Aq(eYJ AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
PIQd=%?' Anisotropic Filtering(各向异性过滤)
qla=LS\-A+ API(Application Programming Interfaces,应用程序接口)
`r\/5|M APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
[fkt3fS APM(Advanced Power Management,高级能源管理)
,~l4-x., APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
l}g_< ARP(Address Resolution Protocol,地址解析协议)
Xo.3OER ASC(Anti Static Coatings,防静电涂层)
wn<k"6x ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
gMZrtK`< ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
>k/
rJ[Sc ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
= 4'r+2[ ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
B&*`A&^y ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
-&v0JvTJ9j ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
r>"l:GZ AST(Average Seek time,平均寻道时间)
.0X 5Vy ATA(AT Attachment,AT扩展型)
~1,$ ATAPI(AT Attachment Packet Interface)
= P$7
" ATC(Access Time from Clock,时钟存取时间)
0\"]XYOH ATL: ActiveX Template Library(ActiveX模板库)
<
r b5' ATM(Asynchronous Transfer Mode,异步传输模式)
+tYskx/ ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
"oR%0pU* ATX: AT Extend(扩展型AT)
}1sd<<\` Auxiliary Input(辅助输入接口)
su8()]|0x AV(Analog Video,模拟视频)
>DzW OB AVI(Audio Video Interleave,音频视频插入)
AVc|(~V Back Buffer,后置缓冲
/" &Jf}r Backface culling(隐面消除)
\C1`F[d_ BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
BBl9<ne$ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
Fj<a;oV BCF(Boot Catalog File,启动目录文件)
9Z3Y, `R, Benchmarks:基准测试程序数值
x:]_z.5 BGA(Ball Grid Array,球状矩阵排列)
H3ob
8+J BGA(Ball Grid Array,球状矩阵排列)
j(_6.zf BGA: Ball Grid Array(球状网格阵列)
@_;vE(!5 BHT(branch prediction table,分支预测表)
JVPLE*T BIF(Boot Image File,启动映像文件)
i^}DIx{ Bilinear Filtering(双线性过滤)
:pP l|" BIOS(Basic Input/Output System,基本输入/输出系统)
$f6wmI;<y BLA: Bearn Landing Area(电子束落区)
2>Kn'p BMC(Black Matrix Screen,超黑矩阵屏幕)
h>|IA@;|f BOD(Bandwidth On Demand,弹性带宽运用)
09Z\F^*$F BOPS:Billion Operations Per Second,十亿次运算/秒
TP=#U^g* bps(bit per second,位/秒)
_ukBp*u BPU(Branch Processing Unit,分支处理单元)
DwXSlsN3v Brach Pediction(分支预测)
%b ^.Gw\L BSD(Berkeley Software Distribution,伯克利软件分配代号)
xw1n;IO4 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
U,~Z 2L BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
sbFA{l3 C2C: card-to-card interleaving,卡到卡交错存取
Reg%ah|$/= CAD: computer-aided design,计算机辅助设计
%#lJn.o CAM(Common Access Model,公共存取模型)
j5 W)9HW: CAS(Column Address Strobe,列地址控制器)
{w9GMqq CBR(Committed Burst Rate,约定突发速率)
CX>QP&Gj CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
<gY.2#6C\% CCD(Charge Coupled Device,电荷连接设备)
Z&J.8A]L CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
=l}XKl-> CCM(Call Control Manager,拨号控制管理)
hOcVxSc. cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
\ 3l3,VYH CCS(Cut Change System)
X]Ma:1+ CCT(Clock Cycle Time,时钟周期)
1jj.oa] CDR(CD Recordable,可记录光盘)
2&:w_KJ CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
m' L8z
fX CDRW(CD-Rewritable,可重复刻录光盘)
xJE26i CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
9,AHC2kn% CE(Consumer Electronics,消费电子)
8lT2qqlr CEM(cube environment mapping,立方环境映射)
f9b[0L Center Processing Unit Utilization,中央处理器占用率
X&|y| CEO(Chief Executive Officer,首席执行官)
/A%31WE&1 CG(Computer Graphics,计算机生成图像)
C;eM:v0A[ CGI(Common Gateway Interface,通用网关接口)
roWg~U(S CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
o~p%ODH CIEA: Commercial Internet Exchange Association,商业因特网交易协会
6^Ax3#q CIR(Committed Infomation Rate,约定信息速率)
f}zv@6#& CISC(Complex Instruction Set Computing,复杂指令集计算机)
P%kJq^& CISC(Complex Instruction Set Computing,复杂指令集计算机)
(>gHfC>(lq CISC: Complex Instruction Set Computing(复杂指令结构)
@ u2P&|:{ Clipping(剪贴纹理)
>l0D,-O]m CLK(Clock Cycle,时钟周期)
=:7OS>x Clock Synthesizer,时钟合成器
L ]Dl}z CLV(Constant Linear Velocity,恒定线速度)
ZS?4<lXF CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
*4{GID CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
$pYT#_P!/ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
'0E^th#u-0 COB(Cache on board,板上集成缓存)
Hd0?}w\ COB(Cache on board,板上集成缓存)
A>Oi9%OY: COD(Cache on Die,芯片内集成缓存)
;{Su:Ixg COD(Cache on Die,芯片内集成缓存)
vip&
b}u COM: Component Object Model(组件对象模式)
vKcc|# COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
/-&a]PJ compressed textures(压缩纹理)
1
c4I`#_v Concurrent Command Engine,协作命令引擎
~z*A%vp6ER COO(Chief Organizer Officer,首席管理官)
W .bJ.hO* CP: Ceramic Package(陶瓷封装)
$+Vp> CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
\y0uGnmCj CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
tGh!5EZ6` CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
5oR/Q|^ CPS: Certification Practice Statement(使用证明书)
KZt4 dr CPU(Center Processing Unit,中央处理器)
D= LLm$y
CPU: Centerl Processing Unit(中央处理器)
[%yCnt CPU:Center Processing Unit,中央处理器
58.b@@T CRC: Cyclical Redundancy Check(循环冗余检查)
,aQ{ CRT(Cathode Ray Tube,阴极射线管)
~OQ/ |ws CS(Channel Separation,声道分离)
(cEjC`] CSE(Configuration Space Enable,可分配空间)
Q GQ}I CSS(Common Command Set,通用指令集)
;chz};zY CSS: Cascading Style Sheets,层叠格式表
YU24wTe;k CTO(Chief Technology Officer,首席技术官)
sas:5iB5 CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
}O7b&G:nW CTS(Clear to Send,清除发送)
Dwp-*QK^G CVS(Compute Visual Syndrome,计算机视觉综合症)