作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
-Z4J?b 3DNow!(3D no waiting)
f/eT4y 3DPA(3D Positional Audio,3D定位音频)
Gxy>aS3 3DS(3D SubSystem,三维子系统)
t \Fc < ABS(Auto Balance System,自动平衡系统)
)wCA8 AC(Audio Codec,音频多媒体数字信号编解码器)
FOM~Uj ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
@HMt}zD ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
:_p3nb[r AE(Atmospheric Effects,雾化效果)
rcF;Lp : AFR(Alternate Frame Rendering,交替渲染技术)
3k5Mty AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
bxqXFy/I AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
HI,1~Jw+ AGU(Address Generation Units,地址产成单元)
<E&1HeP AH: Authentication Header,鉴定文件头
Iwize,J~X AHA(Accelerated Hub Architecture,加速中心架构)
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P4 AL: Artificial Life(人工生命)
j/#kO? ALU(Arithmetic Logic Unit,算术逻辑单元)
NA]7qb%%< AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
[qIi_(%o AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
;]i&AAbj Anisotropic Filtering(各向异性过滤)
RR75ke[Hs API(Application Programming Interfaces,应用程序接口)
[WRs1$5 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
ryW1OV6?_0 APM(Advanced Power Management,高级能源管理)
V%<<Udu< APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
fP&F$"o8 ARP(Address Resolution Protocol,地址解析协议)
@zT.&1;` ASC(Anti Static Coatings,防静电涂层)
n-}:D<\7 ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
yodJGGAzk ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
c<y.Y0 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
~Rs|W; ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
9hmCvQgtf ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
\-#~)LB]M ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
xX{uDMYa; AST(Average Seek time,平均寻道时间)
L<1"u.3Z`} ATA(AT Attachment,AT扩展型)
9bMM-~ ATAPI(AT Attachment Packet Interface)
!|9$ ATC(Access Time from Clock,时钟存取时间)
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x;( ATL: ActiveX Template Library(ActiveX模板库)
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ATM(Asynchronous Transfer Mode,异步传输模式)
U#Wc!QN-t ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
uQ vW@Tt ATX: AT Extend(扩展型AT)
Gyjx:EM Auxiliary Input(辅助输入接口)
~V`D@-VND AV(Analog Video,模拟视频)
9RE{,mos2v AVI(Audio Video Interleave,音频视频插入)
>#$(M5&}- Back Buffer,后置缓冲
HvKueTQ Backface culling(隐面消除)
XG<^j}H{} BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
HdJLD+k/ Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
i74^J +xk BCF(Boot Catalog File,启动目录文件)
wTf0O@``6H Benchmarks:基准测试程序数值
v|?hc'Fj BGA(Ball Grid Array,球状矩阵排列)
nxsQDw\hy BGA(Ball Grid Array,球状矩阵排列)
3+EJ% BGA: Ball Grid Array(球状网格阵列)
2^ ^;Q: BHT(branch prediction table,分支预测表)
P>)-uLc~W BIF(Boot Image File,启动映像文件)
_ZzN}!Mye Bilinear Filtering(双线性过滤)
,au64sH BIOS(Basic Input/Output System,基本输入/输出系统)
&VY;Al BLA: Bearn Landing Area(电子束落区)
=<O{t#] BMC(Black Matrix Screen,超黑矩阵屏幕)
[YHvyfk~_ BOD(Bandwidth On Demand,弹性带宽运用)
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nY] BOPS:Billion Operations Per Second,十亿次运算/秒
ojs&W]r0Z bps(bit per second,位/秒)
q&<#)#+ BPU(Branch Processing Unit,分支处理单元)
/quf'CV} Brach Pediction(分支预测)
W ;P1T"*A BSD(Berkeley Software Distribution,伯克利软件分配代号)
R`76Ae`R8 BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
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1 BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
Dr6Br<yi C2C: card-to-card interleaving,卡到卡交错存取
c~5#)AXMT CAD: computer-aided design,计算机辅助设计
N5}vy$t_P CAM(Common Access Model,公共存取模型)
\S=!la_T@m CAS(Column Address Strobe,列地址控制器)
9(ZzwkD'> CBR(Committed Burst Rate,约定突发速率)
mIFS/C CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
@Sq=#f/= CCD(Charge Coupled Device,电荷连接设备)
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+ CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
~_8Ve\Y^ / CCM(Call Control Manager,拨号控制管理)
cuq7eMG6z cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
Y@9L8XNP> CCS(Cut Change System)
DECX18D CCT(Clock Cycle Time,时钟周期)
/v5Pk.!o CDR(CD Recordable,可记录光盘)
7KRc^ *pZs CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
%b\xRt[0v7 CDRW(CD-Rewritable,可重复刻录光盘)
t<ftEJU"'w CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
S/~6%uJ CE(Consumer Electronics,消费电子)
~<v{CBq[ CEM(cube environment mapping,立方环境映射)
@T;O^rE~N Center Processing Unit Utilization,中央处理器占用率
6|T{BOW!d CEO(Chief Executive Officer,首席执行官)
[cXu<vjFM CG(Computer Graphics,计算机生成图像)
g_0"T}09( CGI(Common Gateway Interface,通用网关接口)
l>~:lBO CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
X2M<DeF: CIEA: Commercial Internet Exchange Association,商业因特网交易协会
puZ<cV
e/ CIR(Committed Infomation Rate,约定信息速率)
zesEbR)j CISC(Complex Instruction Set Computing,复杂指令集计算机)
uqTOEHH7 CISC(Complex Instruction Set Computing,复杂指令集计算机)
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CISC: Complex Instruction Set Computing(复杂指令结构)
@h>#cwhU Clipping(剪贴纹理)
)6bxP&k CLK(Clock Cycle,时钟周期)
sn5N9=\+T Clock Synthesizer,时钟合成器
_N/]&|.. ! CLV(Constant Linear Velocity,恒定线速度)
Xuh_bW&zF CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
"{z9 L+ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
`3pe\s CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
j@GMZz< COB(Cache on board,板上集成缓存)
m9#u.Q* COB(Cache on board,板上集成缓存)
g+ 2SB5 2D COD(Cache on Die,芯片内集成缓存)
RVI],O COD(Cache on Die,芯片内集成缓存)
Vq9hAD|k COM: Component Object Model(组件对象模式)
o&(%:| COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
ni2H~{]z
compressed textures(压缩纹理)
Ic#+*W\ZW Concurrent Command Engine,协作命令引擎
/rvXCA)j
COO(Chief Organizer Officer,首席管理官)
t$l[ 4
R- CP: Ceramic Package(陶瓷封装)
a Q`a>&R0 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
mNb+V /*x3 CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
<i]%T~\Af) CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
U?$v1 || CPS: Certification Practice Statement(使用证明书)
a P{xMB#1h CPU(Center Processing Unit,中央处理器)
B1nb23SY T CPU: Centerl Processing Unit(中央处理器)
wf|CE410 CPU:Center Processing Unit,中央处理器
!c SD9q* CRC: Cyclical Redundancy Check(循环冗余检查)
Vg:P@6s CRT(Cathode Ray Tube,阴极射线管)
^jf$V#z0/ CS(Channel Separation,声道分离)
Dcus-,u~ CSE(Configuration Space Enable,可分配空间)
\?3];+c9 CSS(Common Command Set,通用指令集)
/3KEX{'@U CSS: Cascading Style Sheets,层叠格式表
6b<t|zb CTO(Chief Technology Officer,首席技术官)
AQQj]7Y CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
JSGUl4N CTS(Clear to Send,清除发送)
De>pIN;B> CVS(Compute Visual Syndrome,计算机视觉综合症)