作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
!wZIXpeL 3DNow!(3D no waiting)
R~;8v1>K 3DPA(3D Positional Audio,3D定位音频)
Pj5:=d8z( 3DS(3D SubSystem,三维子系统)
IBW-[lr7 ABS(Auto Balance System,自动平衡系统)
`trcYmR=k AC(Audio Codec,音频多媒体数字信号编解码器)
6LqF*$+$` ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
o)'06FF\$ ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
D4?cnwU AE(Atmospheric Effects,雾化效果)
JM53sx4& AFR(Alternate Frame Rendering,交替渲染技术)
<L2z| %` AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
=dp`4N AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
R'oGsaPB2 AGU(Address Generation Units,地址产成单元)
hdqr~9 AH: Authentication Header,鉴定文件头
$8Z4jo AHA(Accelerated Hub Architecture,加速中心架构)
S7@/dHN AL: Artificial Life(人工生命)
sWi4+PAM0 ALU(Arithmetic Logic Unit,算术逻辑单元)
Sae*VvT6 AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
N,*'")k9 AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
vtc%MG1 Anisotropic Filtering(各向异性过滤)
Ga pM~~ API(Application Programming Interfaces,应用程序接口)
/!60oV4p0 APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
Q@*9|6- APM(Advanced Power Management,高级能源管理)
/PG%Y]l0b APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
anORoK. ARP(Address Resolution Protocol,地址解析协议)
n;>r ASC(Anti Static Coatings,防静电涂层)
O@skd2 ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
mqY=N~/O ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
gb}ov** ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
}^*`&Lh ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
=>O{hT^F ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
*=Ma5J. ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
|`+ (O AST(Average Seek time,平均寻道时间)
:z\||f ATA(AT Attachment,AT扩展型)
kZfj"+p_S ATAPI(AT Attachment Packet Interface)
eu//Q'W ATC(Access Time from Clock,时钟存取时间)
*g4Uo{ ATL: ActiveX Template Library(ActiveX模板库)
![eipOX ATM(Asynchronous Transfer Mode,异步传输模式)
HaR x(p0 ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
5JG`FRW! ATX: AT Extend(扩展型AT)
om6`>I* Auxiliary Input(辅助输入接口)
Vygh|UEo AV(Analog Video,模拟视频)
b$tf9$f AVI(Audio Video Interleave,音频视频插入)
GKG:iR) Back Buffer,后置缓冲
+Q"XwxL<6 Backface culling(隐面消除)
qVvnl BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
-WGlOpg0; Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
h|<;:o?yh BCF(Boot Catalog File,启动目录文件)
`6PBV+]Vm3 Benchmarks:基准测试程序数值
4I.)>+8V BGA(Ball Grid Array,球状矩阵排列)
2/x~w~3U BGA(Ball Grid Array,球状矩阵排列)
Z`n "}{ BGA: Ball Grid Array(球状网格阵列)
^}<]sjmk BHT(branch prediction table,分支预测表)
C\0,D9 BIF(Boot Image File,启动映像文件)
>}d6)s| Bilinear Filtering(双线性过滤)
9QeBz`lm) BIOS(Basic Input/Output System,基本输入/输出系统)
$-\%%n0>6 BLA: Bearn Landing Area(电子束落区)
cVSns\QO BMC(Black Matrix Screen,超黑矩阵屏幕)
GbvbGEG BOD(Bandwidth On Demand,弹性带宽运用)
hK3Twzte BOPS:Billion Operations Per Second,十亿次运算/秒
8L`wib2 bps(bit per second,位/秒)
YI]/gWeu BPU(Branch Processing Unit,分支处理单元)
xJOp~fKG Brach Pediction(分支预测)
|{rhks~ BSD(Berkeley Software Distribution,伯克利软件分配代号)
~W3t(\B' BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
8sq0 BH BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
8SCXA9} C2C: card-to-card interleaving,卡到卡交错存取
aaI5x CAD: computer-aided design,计算机辅助设计
SXV2Y- CAM(Common Access Model,公共存取模型)
<irr.O CAS(Column Address Strobe,列地址控制器)
s,M]f,T CBR(Committed Burst Rate,约定突发速率)
8/~@3-9EK CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
?}C8_I|4~ CCD(Charge Coupled Device,电荷连接设备)
}hXmK.[' CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
Xod/GYG CCM(Call Control Manager,拨号控制管理)
2N.!#~_2 D cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
{9~3y2: CCS(Cut Change System)
m,F4N$ CCT(Clock Cycle Time,时钟周期)
&C#?&AQ CDR(CD Recordable,可记录光盘)
:1~4X CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
>&T J CDRW(CD-Rewritable,可重复刻录光盘)
}xgs]\^,73 CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
%V(U]sbV CE(Consumer Electronics,消费电子)
hl,x|.f}4Y CEM(cube environment mapping,立方环境映射)
dSS Ai
|} Center Processing Unit Utilization,中央处理器占用率
+}BKDEb CEO(Chief Executive Officer,首席执行官)
$`L
| CG(Computer Graphics,计算机生成图像)
/KlSI<T@ CGI(Common Gateway Interface,通用网关接口)
WqHp23 CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
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}Vnv1[ CIEA: Commercial Internet Exchange Association,商业因特网交易协会
e_FoNT CIR(Committed Infomation Rate,约定信息速率)
%)e&"mq!| CISC(Complex Instruction Set Computing,复杂指令集计算机)
V\AF%=6} CISC(Complex Instruction Set Computing,复杂指令集计算机)
.la_u8A] CISC: Complex Instruction Set Computing(复杂指令结构)
;rXZ?" Clipping(剪贴纹理)
]zI*}(adu CLK(Clock Cycle,时钟周期)
{Ut,xi Clock Synthesizer,时钟合成器
k40`,;}9 CLV(Constant Linear Velocity,恒定线速度)
ZtpbKy!\$B CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
IYhn* CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
5 &]a8p{ CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
$$'[% COB(Cache on board,板上集成缓存)
\WZSY||C|_ COB(Cache on board,板上集成缓存)
+0:]KG!Zs. COD(Cache on Die,芯片内集成缓存)
4v`;D,dIu COD(Cache on Die,芯片内集成缓存)
WKq{g+a COM: Component Object Model(组件对象模式)
x(:alG%# COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
JE;!~= compressed textures(压缩纹理)
=ibKdPtTh^ Concurrent Command Engine,协作命令引擎
(,RL\1zJ COO(Chief Organizer Officer,首席管理官)
WogCt, CP: Ceramic Package(陶瓷封装)
so@ijl4{Z CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
[`1@`5SL- CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
= @lM* CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
VrJf g CPS: Certification Practice Statement(使用证明书)
VzWH9%w CPU(Center Processing Unit,中央处理器)
sTxbh2 CPU: Centerl Processing Unit(中央处理器)
F 2Mxcs*M CPU:Center Processing Unit,中央处理器
*tl; 0<n CRC: Cyclical Redundancy Check(循环冗余检查)
N\fj[?f[ CRT(Cathode Ray Tube,阴极射线管)
J #;|P-pt CS(Channel Separation,声道分离)
$qiM_06 CSE(Configuration Space Enable,可分配空间)
.Z@ i z5 CSS(Common Command Set,通用指令集)
VD+v\X_ CSS: Cascading Style Sheets,层叠格式表
c']m5q39' CTO(Chief Technology Officer,首席技术官)
dfXBgsc6i CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
a*nCvZ
CTS(Clear to Send,清除发送)
a@C}0IP) CVS(Compute Visual Syndrome,计算机视觉综合症)