作者:不详 来源:不详
http://www.csai.cn 2006年4月20日
w&eX)! 3DNow!(3D no waiting)
E,]G Ek 3DPA(3D Positional Audio,3D定位音频)
<<zYF.9L] 3DS(3D SubSystem,三维子系统)
(p2jigP7a[ ABS(Auto Balance System,自动平衡系统)
p#VA-RSUQ| AC(Audio Codec,音频多媒体数字信号编解码器)
N|n"JKw) ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
Oy:;v7 ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
J2"n: AE(Atmospheric Effects,雾化效果)
TG\3T%gH/s AFR(Alternate Frame Rendering,交替渲染技术)
0] 'Bd`e AGAS(Anti Glare Anti Static Coatings,防强光、防静电涂层)
; ]*
%wX AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构
H\OV7=8 AGU(Address Generation Units,地址产成单元)
SH"e x,= AH: Authentication Header,鉴定文件头
Iv6(Z>pAB AHA(Accelerated Hub Architecture,加速中心架构)
^f:oKKaAW; AL: Artificial Life(人工生命)
qSRE)C=) ALU(Arithmetic Logic Unit,算术逻辑单元)
(x{6N^J.t AMR(Audio/Modem Riser,音效/数据主机板附加直立插卡)
l-Hp^|3Wq AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
ggr\nY Anisotropic Filtering(各向异性过滤)
PVGvj c API(Application Programming Interfaces,应用程序接口)
pDGX$1O" APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)
X>Cl{. APM(Advanced Power Management,高级能源管理)
B|Y6;4? APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)
(mHCK5 ARP(Address Resolution Protocol,地址解析协议)
481SDG[b ASC(Anti Static Coatings,防静电涂层)
|IbCN ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
_5F8F4QY` ASCII(American Standard Code for Information Interchange,美国国家标准信息交换代码)
0XCtw6 ASIC: Application Specific Integrated Circuit(特殊应用积体电路)
$
e<&7 ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
Zrtyai{8l ASMO(Advanced Storage Magneto-Optical,增强形光学存储器)
-^m]Tb<u ASPI(Advanced SCSI Program Interface, 高级SCSI编程接口。它定义了当和SCSI主机适配器通讯时应用程序使用的一系列软件命令)
uqaP\ AST(Average Seek time,平均寻道时间)
q[l!kC+Eh ATA(AT Attachment,AT扩展型)
\,<5U
F0 ATAPI(AT Attachment Packet Interface)
zJnF#G ATC(Access Time from Clock,时钟存取时间)
0v%ZKvSID ATL: ActiveX Template Library(ActiveX模板库)
$"z|^ze ATM(Asynchronous Transfer Mode,异步传输模式)
W0n/B&C ATOMM(Advanced super Thin-layer and high-Output Metal Media,增强形超薄高速金属媒体)
o ]UG*2 ATX: AT Extend(扩展型AT)
|p"P+"# Auxiliary Input(辅助输入接口)
~yQby&s AV(Analog Video,模拟视频)
P8lx\DA AVI(Audio Video Interleave,音频视频插入)
`uz15])1< Back Buffer,后置缓冲
$9pFRQC'q Backface culling(隐面消除)
KTV~g@Jf BASIC:Beginner's All-purpose Symbolic Instruction Code(初学者通用指令代码)
Yx4TUA$c' Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
oMH-mG7:K BCF(Boot Catalog File,启动目录文件)
:J|t! ` Benchmarks:基准测试程序数值
}%K)R5C BGA(Ball Grid Array,球状矩阵排列)
=-XI)JV# BGA(Ball Grid Array,球状矩阵排列)
0{0|M8 BGA: Ball Grid Array(球状网格阵列)
jpcbW BHT(branch prediction table,分支预测表)
YK[PC]w BIF(Boot Image File,启动映像文件)
Q/oe l'O*x Bilinear Filtering(双线性过滤)
ai7*</ls BIOS(Basic Input/Output System,基本输入/输出系统)
Ob:}@jj BLA: Bearn Landing Area(电子束落区)
N/ 7Q(^ BMC(Black Matrix Screen,超黑矩阵屏幕)
E1(2wJ-3" BOD(Bandwidth On Demand,弹性带宽运用)
FdR!jt BOPS:Billion Operations Per Second,十亿次运算/秒
>k gL N bps(bit per second,位/秒)
W,<P]) BPU(Branch Processing Unit,分支处理单元)
Q;]g9T[) Brach Pediction(分支预测)
S2/6VoGE BSD(Berkeley Software Distribution,伯克利软件分配代号)
\ /(;LHWQ BSRAM(Burst pipelined synchronous static RAM,突发式管道同步静态存储器)
DYS|"tSk BTB/C: Branch Target Buffer/Cache (分支目标缓冲)
A=LyN$% C2C: card-to-card interleaving,卡到卡交错存取
=+K2`=y;WF CAD: computer-aided design,计算机辅助设计
zmV5k CAM(Common Access Model,公共存取模型)
VqzcTr]_ CAS(Column Address Strobe,列地址控制器)
AS;EO[Vn CBR(Committed Burst Rate,约定突发速率)
1&S34wJF CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组
95Q{d'& CCD(Charge Coupled Device,电荷连接设备)
`Zn2Vx CCIRN: Coordinating Committee for Intercontinental Research Networking,洲
9[<,49 CCM(Call Control Manager,拨号控制管理)
6#egy|("nF cc-NUMA(cache-coherent non uniform memory access,连贯缓冲非统一内存寻址)
5^"T`,${ CCS(Cut Change System)
}!tJ3G CCT(Clock Cycle Time,时钟周期)
CRK%%;=> CDR(CD Recordable,可记录光盘)
A#:5b5R CD-ROM/XA(CD-ROM eXtended Architecture,唯读光盘增强形架构)
%y(oY CDRW(CD-Rewritable,可重复刻录光盘)
A^/$ |@ CDSL: Consumer Digital Subscriber Line(消费者数字订阅线路)
MO7:ZYq CE(Consumer Electronics,消费电子)
Vo@[ CEM(cube environment mapping,立方环境映射)
mK!73<p_ Center Processing Unit Utilization,中央处理器占用率
jfxW9][ CEO(Chief Executive Officer,首席执行官)
RQzcsO CG(Computer Graphics,计算机生成图像)
rQ0V3x1"Qx CGI(Common Gateway Interface,通用网关接口)
*XRAM. CHRP(Common Hardware Reference Platform,共用硬件平台,IBM为PowerPC制定的标准,可以兼容Mac OS, Windows NT, Solaris, OS/2, Linux和AIX等多种操作系统)
h,:8TMJRRN CIEA: Commercial Internet Exchange Association,商业因特网交易协会
"i+fO&LpZ CIR(Committed Infomation Rate,约定信息速率)
nwH'E CISC(Complex Instruction Set Computing,复杂指令集计算机)
]#n,DU}V CISC(Complex Instruction Set Computing,复杂指令集计算机)
nJ!`^X5I CISC: Complex Instruction Set Computing(复杂指令结构)
qA4w*{JN Clipping(剪贴纹理)
yDwG,)m 4s CLK(Clock Cycle,时钟周期)
;t'~ Clock Synthesizer,时钟合成器
&X0qH8W CLV(Constant Linear Velocity,恒定线速度)
}O+F#/6 CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)
o.qeF4\d6 CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
<k2Qcicy CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
dl:uI5] COB(Cache on board,板上集成缓存)
EeW %5/; COB(Cache on board,板上集成缓存)
4%h@K(iN COD(Cache on Die,芯片内集成缓存)
P<AN`un
COD(Cache on Die,芯片内集成缓存)
/RLeD COM: Component Object Model(组件对象模式)
2yYq/J COMDEX : Computer Distribution Exposition(计算机代理分销业展览会)
J(CqT/Au- compressed textures(压缩纹理)
qla$}dnvc Concurrent Command Engine,协作命令引擎
3GkVMYI COO(Chief Organizer Officer,首席管理官)
|Gc2w]\3 CP: Ceramic Package(陶瓷封装)
RS'%;B-) CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
&|t*9D CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
9~8UG ( CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)
?S9!;x< CPS: Certification Practice Statement(使用证明书)
P
I gbeP CPU(Center Processing Unit,中央处理器)
N7A/&~g5L CPU: Centerl Processing Unit(中央处理器)
N%1T>cp0 CPU:Center Processing Unit,中央处理器
=d#3& R]p CRC: Cyclical Redundancy Check(循环冗余检查)
%xE9vN; CRT(Cathode Ray Tube,阴极射线管)
P{
AJH1 CS(Channel Separation,声道分离)
2jQ|4$9j CSE(Configuration Space Enable,可分配空间)
h= uv4& CSS(Common Command Set,通用指令集)
iV8j(HV CSS: Cascading Style Sheets,层叠格式表
G813NoS o CTO(Chief Technology Officer,首席技术官)
l1X&Nw1W CTS(Carpal Tunnel Sydrome,计算机腕管综合症)
-V
Rby CTS(Clear to Send,清除发送)
aBX^Wd CVS(Compute Visual Syndrome,计算机视觉综合症)